Data Center & AI Cooling Solutions

Data Center & AI Cooling Solutions

As AI data centers and High-Performance Computing (HPC) nodes escalate in power density, traditional air cooling is no longer viable. Our liquid cooling interconnection solutions are engineered to provide ultra-reliable thermal management for mission-critical hardware environments.

  • Comprehensive Loop Foundation
  • Streamlined Maintenance
  • Guaranteed Uptime
Liquid-Cooled Cold Plate System
  • Specialized for Direct-to-Chip (D2C) cooling arrays and Rack Cooling Distribution Units (CDUs).

  • Advanced Quick Disconnect (QD) couplings enable zero-spill hot-swapping and simplify installation in dense server architectures.

  • Eliminates coolant leakage risks to ensure continuous server operation and optimal thermal transfer efficiency.

UQD & UQDB Series: Zero-Spill Interconnections

Engineered specifically for rack manifolds and CDUs, this series strictly meets ultra-low to zero coolant spillage requirements to mitigate short-circuit risks in high-value AI GPU racks.

    • Dripless Technology: Utilizes advanced non-spill flat-face valve technology to prevent fluid loss and air inclusion during mating cycles.

    • Safe Hot-Swapping: Dry-break capability ensures fast and clean maintenance without disrupting continuous server operation.

    • Technical Specifications: Supports a maximum operating pressure of 150 psi and an operating temperature range of -40°C to +150°C.

GUQD Series: High-Density Blind Mating

Structurally tailored to support the rigorous demands of Open Compute Project (OCP) compliant high-density server racks, resolving the complexities of limited visibility and tight spatial constraints.

    • Stress-Free Engagement: An integrated robust guidance mechanism allows for seamless connection between the IT gear and rack manifolds.

    • Rapid Deployment: Drastically reduces installation time and eliminates mechanical stress on fluid loops in dense HPC environments.

SQD Series: Compact Reliability for D2C Systems

Optimized for the severe spatial constraints of modern processors, delivering high flow performance within a minimized footprint for Direct-to-Chip (D2C) liquid cooling applications.

    • Optimized Flow Dynamics: Maximizes the flow coefficient (Cv) while minimizing pressure drop for highly efficient heat dissipation.

    • Mission-Critical Durability: Constructed with corrosion-resistant alloys and dual EPDM sealing architectures for maximum reliability.

    • Long-Term Stability: Rated for over 10,00 durable mating cycles to safeguard intensive computing nodes.

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