UQD06 Socket, OCP Standard Liquid Cooling Connector, Stainless Steel 316L, GB Male Thread

Yes. Both UQD and UQDB series are fully compliant with OCP (Open Compute Project) V1.0+ and Intel-led industry specifications. This guarantees 100% interoperability and physical compatibility with other standardized manifolds and cooling infrastructure from global suppliers, preventing vendor lock-in.

The safety of sensitive AI/GPU hardware is managed through our Double Shut-off Dry-Break technology. The internal valves are engineered to restrict fluid spillage to less than 0.05cc per disconnection. This near-zero spillage prevents air ingress and moisture contamination, ensuring maximum system uptime during live maintenance.

While both share core internal architectures:

• UQD (Manual / Standard): Optimized for manual maintenance. It features a standard push-to-connect mechanism with Red/Blue color-coded rings for instant line identification. It is the go-to solution for external manifold-to-rack connections where manual accessibility is clear.
• UQDB (Blind-Mate / Dry-Break): Specifically engineered for automated chassis-level docking. The “B” stands for Blind-mate. It incorporates a high-precision Double Shut-off valve design that ensures a “Dry-break” disconnection with near-zero spillage (<0.05cc). Additionally, it features a floating flange that compensates for up to 0.8mm of radial misalignment, making it ideal for invisible, high-density rear-plugging in server blades.

The UQDB series is designed to handle the structural offsets common in high-density rack systems. It incorporates radial compensation technology that allows for a misalignment of up to 0.8mm. This ensures a secure, leak-free connection even if the server blade and manifold are slightly out of alignment.

To meet various cooling requirements (from individual chips to full racks), we provide standardized sizes including DN03, DN05, DN07, and DN10. We maintain detailed flow rate and pressure drop curves for each diameter to assist thermal engineers in calculating precise pump efficiency.

Absolutely. Constructed from premium SUS316L stainless steel with high-grade EPDM seals, these connectors operate reliably across a wide temperature range of -40°C to +120°C. They are fully compatible with deionized water, water-glycol solutions, and common dielectric fluids used in high-performance computing.

Designed for long-term infrastructure reliability, these connectors have a rated mechanical life of over 5,000 mating cycles. Given the high-grade materials and low-friction internal design, they require minimal maintenance and are built to outlast the typical 5-10 year lifecycle of data center hardware.

The Push-to-Connect mechanism allows technicians to mate or decouple connections with one hand, requiring no specialized tools. In a dense environment with hundreds of connection points, this significantly reduces labor time, lowers the risk of tool-inflicted damage, and minimizes human error during emergency servicing.

For in-stock items, orders are typically processed and shipped within 1-2 business days. For standard configurations requiring new production, our agile manufacturing capabilities allow us to deliver in as fast as 7 to 14 days. We recommend contacting our sales team to verify real-time inventory for your specific Part Number.

You can easily request comprehensive product specifications and test samples by clicking the “Inquiry” or “Live Chat” button on our page. Our technical sales team will respond promptly to support your project design.